Optimisation of Thiourea Concentration in a Decorative Copper Plating Acid Bath Based on Methanesulfonic Electrolyte

The role of thiourea as an organic additive in the nucleation and growth mechanism was studied for copper deposition its application decorative electroplating fashion accessory industries. bath designed to reduce environmental ecological impacts using methanesulfonic acid electrolyte alternative alkaline cyanide baths. We evaluated exploiting voltametric chronoamperometric measurements with a brightener concentration ranging from 0 90 ppm. used Scharifker–Hills model estimate type after progressive addition thiourea. Scanning electron microscope employed surface analysis morphological characterisation nuclei. verified that is key step obtainment shiny homogeneous film, but excess could cause parasitic adsorption reactions on substrate. X-ray fluorescence spectroscopy thickness determination deposits electrodeposition efficiency correlated concentration. Finally, optimal assessed be 60 ppm formulation plating.